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SCIE外文期刊 中科分区:2区   期发文量:21   国人占比:1.59%   影响因子:0.0000
Journal of Modern Dynamics《现代动力学期刊》(一年1卷). The Journal of Modern Dynamics (JMD) is dedicated to publishing research articles in active and promising areas in the theory of dynamical systems with particular emphasis on the mutual interaction between dynamics and other major areas of mathematical research, including: Number theory; Symplectic geometry; Differential geometry; Rigidity; Quantum chaos; Teichmüller theory; Geometric group theory; Harmonic analysis on manifolds.
SCIE外文期刊 中科分区:4区   期发文量:17   国人占比:21.57%   影响因子:0.0000
Journal of Mining Science《矿业科学杂志》(双月刊). The Journal reflects the current trends of development in fundamental and applied mining sciences. It publishes original articles on geomechanics and geoinformation science, investigation of relationships between global geodynamic processes and man-induced disasters, physical and mathematical modeling of rheological and wave processes in multiphase structural geological media, rock failure, analysis and synthesis of mechanisms, automatic machines, and robots, science of mining machines, creation of resource-saving and ecologically safe technologies of mineral mining, mine aerology and mine thermal physics, coal seam degassing, mechanisms for origination of spontaneous fires and methods for their extinction, mineral dressing, and bowel exploitation.
SCIE外文期刊 中科分区:4区   期发文量:13   国人占比:41.03%   影响因子:0.0000
Journal of Mining and Metallurgy, Section B: Metallurgy《采矿与冶金杂志B:冶金》(一年3期). Journal of Mining and Metallurgy, Section B: Metallurgy presents an international medium for the publication of contributions to original research which reflect the new signs of progress in the theory and practice of metallurgy. The Journal covers the latest research in all aspects of metallurgy including hydrometallurgy, pyrometallurgy, electrometallurgy, transport phenomena, process control, solidification, mechanical working, solid-state reactions, materials processing, surface treatment, and relationships among processing, structure, and properties of materials.
SCIE外文期刊 中科分区:2区   期发文量:10   国人占比:25.81%   影响因子:0.0000
Journal of Minimally Invasive Gynecology《微创妇科杂志》(月刊). The Journal of Minimally Invasive Gynecology, formerly titled The Journal of the American Association of Gynecologic Laparoscopists, is an international clinical forum for the exchange and dissemination of ideas, findings and techniques relevant to gynecologic endoscopy and other minimally invasive procedures. The Journal, which presents research, clinical opinions and case reports from the brightest minds in gynecologic surgery, is an authoritative source informing practicing physicians of the latest, cutting-edge developments occurring in this emerging field.
SCIE外文期刊 中科分区:4区   期发文量:20   国人占比:18.64%   影响因子:0.0000
Journal of Minimal Access Surgery《微创外科杂志》(季刊). Journal of Minimal Access Surgery (JMAS), the official publication of Indian Association of Gastrointestinal Endo Surgeons, launched in early 2005. The JMAS, a quarterly publication, is the first English-language journal from India, as also from this part of the world, dedicated to Minimal Access Surgery. The JMAS boasts an outstanding editorial board comprising of Indian and international experts in the field.
SCIE外文期刊 中科分区:4区   期发文量:15   国人占比:4.44%   影响因子:0.0000
Journal of Mineralogical and Petrological Sciences《矿物与岩石学杂志》(一年1卷). Journal of Mineralogical and Petrological Sciences (JMPS) publishes original articles, reviews and letters in the fields of mineralogy, petrology, economic geology, geochemistry, planetary materials science, and related scientific fields. As an international journal, we aim to provide worldwide diffusion for the results of research in Japan, as well as to serve as a medium with high impact factor for the global scientific communication.
SCIE外文期刊 中科分区:4区   期发文量:5   国人占比:18.75%   影响因子:0.0000
Journal of Microwave Power and Electromagnetic Energy《微波与电磁能杂志》(季刊). The Journal of the Microwave Power Energy (JMPEE) is a quarterly publication of the International Microwave Power Institute (IMPI), aimed to be one of the primary sources of the most reliable information in the arts and sciences of microwave and RF technology. JMPEE provides space to engineers and researchers for presenting papers about non-communication applications of microwave and RF, mostly industrial, scientific, medical and instrumentation.
SCIE外文期刊 中科分区:4区   期发文量:8   国人占比:13.04%   影响因子:0.0000
Journal of Microscopy《显微镜学期刊》(月刊). The Journal of Microscopy is for scientists and technologists that use any form of microscopy, spatially resolved spectroscopy, compositional mapping, microanalysis and image analysis. This includes technology and applications in physics, chemistry, material and biological sciences. The Journal of Microscopy is particularly interested in papers on original applications and developments in microscopy.
SCIE外文期刊 中科分区:1区   期发文量:9   国人占比:0.00%   影响因子:0.0000
Journal of Micropalaeontology《古微生物学杂志》(半年刊). The Journal of Micropalaeontology (JM) is an established international journal covering all aspects of microfossils and their application to both applied studies and basic research. In particular we welcome submissions relating to microfossils and their application to palaeoceanography, palaeoclimatology, palaeobiology, evolution, taxonomy, environmental change and molecular phylogeny. Owned by The Micropalaeontological Society, the scope of the journal is broad, demonstrating the application of microfossils to solving broad geoscience issues.
SCIE外文期刊 中科分区:3区   期发文量:12   国人占比:13.89%   影响因子:0.0000
Journal of Micro/Nanopatterning, Materials, and Metrology (JM3)《微/纳米图案化,材料与计量学期刊》(季刊). The Journal of Micro/Nanopatterning, Materials, and Metrology (JM3) publishes peer-reviewed papers on the core enabling technologies that address the patterning needs of the electronics industry. Formerly the Journal of Micro/Nanolithography, MEMS, and MOEMS, the journal’s key subject areas include the science, development, and practice of lithographic, computational, etch, and integration technologies. In this context the electronics industry includes but is not limited to integrated circuits and multichip modules, and advanced packaging with features in the submicron regime.
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