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INTERNATIONAL JOURNAL OF MATERIALS & PRODUCT TECHNOLOGY《国际材料与产品技术杂志》
年8期 - 瑞士
  • INTERNATIONAL JOURNAL OF MATERIALS & PRODUCT TECHNOLOGY《国际材料与产品技术杂志》
  • SCIE外文期刊
  • 期发文量9
  • 国人占比66.67%
  • 知网外文库
  • 投稿方式--官网投稿
  • 期刊属性

  • 中科分区:4区
    OA期刊:混合
  • 综述期刊:
    TOP期刊:
  • 期均国文:6
    环比增速:0.00%
  • 期刊信息

  • 研究方向:材料科学-MATERIALS SCIENCE, MULTIDISCIPLINARY材料科学:综合
  • 国际刊号:ISSN 0268-1900;EISSN 1741-5209
  • 期刊语言:英语
    出版地区:瑞士
  • 投稿网址:https://www.inderscience.com/mobile/journal/insubmithere.php?jcode=ijmpt
  • 电子邮箱:
  • 期刊官网:https://www.inderscience.com/jhome.php?jcode=ijmpt
  • 作者指南:
  • 出版商网址:https://www.inderscienceonline.com/
  • 出版地址:INDERSCIENCE ENTERPRISES LTD, WORLD TRADE CENTER BLDG, 29 ROUTE DE PRE-BOIS, CASE POSTALE 896, GENEVA, SWITZERLAND, CH-1215
  • 期刊简介:INTERNATIONAL JOURNAL OF MATERIALS & PRODUCT TECHNOLOGY《国际材料与产品技术杂志》(一年8期). IJMPT is a refereed and authoritative publication which provides a forum for the exchange of information and ideas between materials academics and engineers working in university research departments and research institutes, and manufacturing, marketing and process managers, designers, technologists and research and development engineers working in industry.

  • 万维提示


  • 1、投稿方式:在线投稿。

    2、期刊网址:

    https://www.inderscience.com/jhome.php?jcode=ijmpt

    3、投稿网址:

    https://www.inderscience.com/mobile/journal/insubmithere.php?jcode=ijmpt

    4、官网邮箱:editorial@inderscience.com(主编)

    5、期刊刊期:一年出版8期。

    2021年1126日星期

                              

     

    投稿须知【官网信息】

     

    About this journal

    Topics covered include

    All aspects of technologies related to materials

    Materials innovation/technology

    Material selection/economics/management

    Interaction between materials/design/manufacturing

    Other aspects of product technology

    Materials fabrication, design for manufacture: CADCAM, CAE, CIM

    Manufacturing methods/technologies

    Joint fixing, bonding, adhesive technology

    Finishing materials, corrosion, protection technology

    Deformation analysis, structural safety, failure preventative technology

    National/international product liability, technical insurance

    Concurrent engineering of advanced materials; TQM

    Smart materials/structures

    Electronic materials, embedded software

    Electronic packaging technology/materials

    Objectives

    The IJMPT aims to address issues of interest to all industrialists and researchers concerned with new materials, new processes and new products.

    Readership

    Professionals, academics, researchers, industrialists, designers and engineers, market and process managers.

    Contents

    The IJMPT publishes original and review papers, technical reports, case studies, conference reports, management reports, book reviews, and notes, commentaries, and news. Contribution may be by submission or invitation, and suggestions for special issues and publications are welcome.

    Submitting articles

    A few essentials for publishing in this journal

    Submitted articles should not have been previously published or be currently under consideration for publication elsewhere.

    Conference papers may only be submitted if the paper has been completely re-written (more details available here) and the author has cleared any necessary permissions with the copyright owner if it has been previously copyrighted.

    Briefs and research notes are not published in this journal.

    All our articles go through a double-blind review process.

    All authors must declare they have read and agreed to the content of the submitted article. A full statement of our Ethical Guidelines for Authors (PDF) is available.

    There are no charges for publishing with Inderscience, unless you require your article to be Open Access (OA). You can find more information on OA here.

    Submission process

    All articles for this journal must be submitted using our online submissions system.

    View Author guidelines.

    Submit here.

     

    Author guidelines

    投稿指南:

    https://www.inderscience.com/mobile/inauthors/index.php?pid=70




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