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IEEE TRANSACTIONS ON MOBILE COMPUTING《IEEE移动计算汇刊》
月刊 - 美国
  • IEEE TRANSACTIONS ON MOBILE COMPUTING《IEEE移动计算汇刊》
  • SCIE外文期刊
  • 期发文量44
  • 国人占比84.21%
  • 维普目次
  • 投稿方式--官网投稿
  • 期刊属性

  • 中科分区:1区
    OA期刊:混合
  • 综述期刊:
    TOP期刊:
  • 期均国文:37
    环比增速:-65.08%
  • 期刊信息

  • 研究方向:计算机科学-COMPUTER SCIENCE, INFORMATION SYSTEMS计算机:信息系统;TELECOMMUNICATIONS电信学
  • 国际刊号:ISSN 1536-1233;EISSN 1558-0660
  • 期刊语言:英语
    出版地区:美国
  • 投稿网址:https://mc.manuscriptcentral.com/tmc-cs
  • 电子邮箱:
  • 期刊官网:https://www.computer.org/csdl/journal/tm
  • 作者指南:
  • 出版商网址:http://www.computer.org
  • 出版地址:IEEE COMPUTER SOC, 10662 LOS VAQUEROS CIRCLE, PO BOX 3014, LOS ALAMITOS, USA, CA, 90720-1314
  • 期刊简介:IEEE TRANSACTIONS ON MOBILE COMPUTING《IEEE移动计算汇刊》(月刊). The IEEE Transactions on Microwave Theory and Techniques focuses on that part of engineering and theory associated with microwave/millimeter-wave components, devices, circuits, and systems involving the generation, modulation, demodulation, control, transmission, and detection of microwave signals.

  • 万维提示


  • 1、投稿方式:在线投稿。

    2、期刊网址:

    https://www.computer.org/csdl/journal/tm

    https://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=7755

    3、投稿网址:

    https://mc.manuscriptcentral.com/tmc-cs

    4、官网邮箱:qianzh@cse.ust.hk(主编)

    (更多编辑邮箱请查看其看官网信息)

    5、期刊刊期:月刊,一年出版12期。

    2021年1119日星期五

                              

     

    投稿须知【官网信息】

     

    IEEE Transactions on Mobile Computing

    Submitting a Paper to TMC

    To submit your paper, please use ScholarOne Manuscripts.

    Detailed information on submitting your paper to TMC can be found on the “Author Information” tab of the Journal Peer Review page.

    Manuscript Types Accepted by TMC

    TMC manuscript types and submission length guidelines are described below. All page limits include references and author biographies. For regular papers, pages in excess of these limits after final layout of the accepted manuscript is complete are subject to Mandatory Overlength Page Charges (MOPC). Note: All supplemental material must be submitted as separate files and must not be included within the same PDF file as the main paper submission. There is no page limit on supplemental files.

    Regular paper – 12 double column pages (Submissions may be up to 18 pages in length, subject to MOPC. All regular paper page limits include references and author biographies.)

    Comments paper – 2 double column pages

    A double column page is defined as a 7.875 x 10.75 page with 9.5-point type and 11.5-point vertical spacing. These length limits are taking into account reasonably-sized figures and references.

    Author Templates

    LaTeX template (TAR)

    LaTeX template (ZIP)

    Word template (ZIP)

    Templates are provided above to assist you with formatting your manuscript. Full specifications on the IEEE Computer Society style can be found in our Style Guide.

    Open Access

    This publication is a hybrid journal, allowing either traditional manuscript submission or author-paid Open Access (OA) manuscript submission.

    The OA option, if selected, enables unrestricted public access to the article via IEEE Xplore and the Computer Society Digital Library with payment of the current Article Processing Charge (APC). The OA option will be offered to the author at the time the manuscript is submitted and the APC must be paid before the article is published in the journal. Please visit the IEEE Open Access FAQ for further details. Authors seeking an APC waiver should submit substantiated evidence and documentation to pubs-waivers@computer.org. Corresponding authors from low-income countries are eligible for waived or reduced open access APCs.

    The traditional option, if selected, enables access to all qualified subscribers and purchasers via IEEE Xplore and the Computer Society Digital Library. No OA payment is required.

    Irrespective of any OA charges, please note that papers which exceed the publication’s stated page limit after acceptance and final layout will be subject to Mandatory Overlength Page Charges.

    The articles in this journal are peer reviewed in accordance with the requirements set forth in the IEEE PSPB Operations Manual (Sections 8.2.1.C & 8.2.2.A). Each published article was reviewed by a minimum of two independent reviewers using a single-blind peer review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors. Articles will be screened for plagiarism before acceptance.



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