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IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION《IEEE电介质与电气绝缘汇刊》
双月刊 - 美国
  • IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION《IEEE电介质与电气绝缘汇刊》
  • SCIE外文期刊
  • 期发文量68
  • 国人占比60.78%
  • 维普目次
  • 投稿方式--官网投稿
  • 期刊属性

  • 中科分区:2区
    OA期刊:混合
  • 综述期刊:
    TOP期刊:
  • 期均国文:41
    环比增速:4.88%
  • 期刊信息

  • 研究方向:工程技术-PHYSICS, APPLIED物理:应用;ENGINEERING, ELECTRICAL ELECTRONIC工程:电子与电气
  • 国际刊号:ISSN 1070-9878;EISSN 1558-4135
  • 期刊语言:英语
    出版地区:美国
  • 投稿网址:http://www.cloznet.com/ieeetdei/ieeetdei.cfm
  • 电子邮箱:
  • 期刊官网:https://ieeedeis.org/publications/transactions-on-dielectrics-and-electrical-insulation/
  • 作者指南:
  • 出版商网址:http://www.ieee.org
  • 出版地址:IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141
  • 期刊简介:IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION《IEEE电介质与电气绝缘汇刊》(双月刊). The IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) publishes articles on dielectric phenomena and measurements to analyze these phenomena; development and characterization of vacuum, gaseous, liquid, and solid dielectrics and electrical insulating components of systems; investigation of dielectric properties for innovative use including functional dielectrics; diagnostic and prognostic methods with a primary focus on the behavior and properties of the electrical insulation in devices under operational stresses. The description of diagnostic methods without a primary link to the dielectric phenomena studied does not belong in these Transactions.

  • 万维提示




  • 1、投稿方式:在线投稿。

    2、期刊网址:

    https://ieeedeis.org/publications/transactions-on-dielectrics-and-electrical-insulation/

    http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=94

    3、投稿网址:

    http://www.cloznet.com/ieeetdei/ieeetdei.cfm

    4、官网邮箱:wubbenhorst@kuleuven.be(主编)

    5、期刊刊期:双月刊,一年出版6期。

    2021年1215日星期三

                                    

     

    投稿须知【官网信息】

     

    The Transactions on Dielectrics and Electrical Insulation publishes four categories of technical reports: papers; reviews; communications; and, dielectric letters and discussions.

    Papers, as described above, are well-documented final reports of research projects.  Communications (up to 5 pages) and Dielectric Letters (up to 3 pages) are shorter and contain noteworthy items of technical interest or ideas requiring rapid publication.

    Reviews are synoptic papers on a subject of general interest, with ample literature references, and written for readers with widely varying backgrounds.

    Discussions on published reports, with author rebuttals, form the fourth category of Transactions on Dielectrics and Electrical Insulation publications.

    The articles in this journal are peer reviewed in accordance with the requirements set forth in the IEEE Publication Services and Products Board Operations Manual. Each published article was reviewed by a minimum of two independent reviewers using a single-blind peer review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors. Articles will be screened for plagiarism before acceptance.

    Submit your Transaction Paper Here.  Includes instructions and template.

     

    Paper Submission Form

    Please fill in all information pertaining to your paper.

    The "More Authors" button should be used to open up more fields to submit all authors

    The Corresponding Author will be used for all future contacts pertaining to this paper.

    If your paper is intended for a special issue please choose the Guest Editor, the Special Issue Title will be autmoatically filled in.

    Please suggest below up to four experts in the area of your paper. The editors may select some or none of them to review your paper.

    Paper Specifications

    Instructions for Authors

    Please submit your file in Microsoft WORD and PDF formats

    Please choose from the Approved Indexing Keyword List

    Please refrain from using umlauts and other special characters, including apostrophes, in the fields below. The "#" character can be used in the address field but not in the file name of your uploading manuscript.

    If the title is changed it should also be entered in this form instead of the previous title.

    Be sure to have adequately cited also all relevant literature from the past two years including papers from these Transactions.





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