- 投稿方式--Email投稿
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期刊属性
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- 中科分区:2区
- OA期刊:否
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- 综述期刊:否
- TOP期刊:否
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- 期均国文:1
- 环比增速:0%


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期刊信息
- 研究方向:工程技术-ENGINEERING, ELECTRICAL ELECTRONIC工程:电子与电气
- 国际刊号:ISSN 1531-636X;EISSN 1558-0830
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- 期刊语言:英语
- 出版地区:美国
- 投稿网址:
- 电子邮箱:yiran.chen@duke.edu (官网邮箱(20211210更新))
- 期刊官网:https://ieeexplore.ieee.org/xpl/aboutJournal.jsp?punumber=7384
- 作者指南:
- 出版商网址:http://www.ieee.org
- 出版地址:IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141
- 期刊简介:IEEE Circuits and Systems Magazine《IEEE电路与系统杂志》(季刊). The magazine covers the subject areas represented by the Societys transactions, including: analog, passive, switch capacitor, and digital filters; electronic circuits, networks, graph theory, and RF communication circuits; system theory; discrete, IC, and VLSI circuit design; multidimensional circuits and systems; large-scale systems and power networks; nonlinear circuits and systems, wavelets, filter banks, and applications; neural networks; and signal processing.
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万维提示
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1、投稿方式:邮箱投稿。
2、期刊网址:
https://ieeexplore.ieee.org/xpl/aboutJournal.jsp?punumber=7384
http://cktse.eie.polyu.edu.hk/IEEE-CASM/
3、官网邮箱:yiran.chen@duke.edu
4、期刊刊期:季刊,一年出版4期。
2021年12月10日星期五
投稿须知【官网信息】
Information for Paper Submission
General Information
The IEEE Circuits and Systems Magazine (Magazine) is a quarterly journal published by the IEEE Circuits and Systems Society. The Magazine publishes featured articles that present tutorials, critical reviews, surveys, technology trends/roadmap, research trends/roadmap, current status, future forecasts, as well as new insights, prospects and challenges in areas of interest within the scope of the circuits and systems society.
The Magazine, however, differs from other IEEE Transactions and Journals in that it does not normally publish original research results or findings unless the topics are of particular emerging importance, and that our editorial board takes editorial discretion in selecting featured articles for publication in order to balance the interest of different technical sectors within circuits and systems. Furthermore, our editorial board is particularly enthusiastic in promoting new and emerging areas, as well as topics with high potential of making significant impact or breakthroughs in applications. As our Magazine runs on a very small page budget, it is not uncommon that many technically correct papers are not accepted for publication, while papers presenting new insights or promoting innovative ideas of wide interest will be accepted.
More information about the Magazine, including the current and past issues, can be found from IEEEXplore homepage of the Magazine.
Submission Procedure
If you wish to submit a paper for publication, please send an extended abstract to the Editor-in-Chief by email (yiran.chen@duke.edu) for an initial quick assessment of suitability of the topic of your paper for publication. The Subject of your email should be: "Abstract submission for IEEE Circuits and Systems Magazine". Editor-in-Chief will normally reply within two weeks whether a full paper should be submitted for review.
Full papers should be submitted to the Editor-in-Chief by email (yiran.chen@duke.edu). Again, the Subject of your email should be: "Paper submission for IEEE Circuits and Systems Magazine". Decision will normally be communicated to the authors within two months. By submitting a manuscript to the magazine, the author(s) acknowledges that the manuscript has not been published or under active consideration in another publication.
Submission of an extended abstract for initial assessment, though not compulsory, is highly recommended as it will often generate useful advices for authors to develop their full papers that will better suit the purpose of the Magazine.
Paper Format for Submission
Extended abstracts and full papers should preferably be submitted in PDF file format for review.
Instructions for preparation of final material for publication will be provided after the papers are accepted for publication. Final material for publication will normally include: (i) Paper in PDF format including all figures; (ii) WORD or LaTeX file(s) of the paper; (iii) all figures in jpg or tif format at resolution of at least 300dpi; (iv) photos of authors in jpg or tif format at resolution of at least 300dpi; (v) bios of authors; (vi) signed IEEE copyright form (submitted online). Final material is preferably packed in a ZIP or TAR file and sent to the Editor-in-Chief via email.
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