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IEEE Transactions on Device and Materials Reliability《IEEE器件与材料可靠性汇刊》
季刊 - 美国
  • IEEE Transactions on Device and Materials Reliability《IEEE器件与材料可靠性汇刊》
  • SCIE外文期刊
  • 期发文量17
  • 国人占比42.31%
  • 维普目次
  • 投稿方式--官网投稿
  • 期刊属性

  • 中科分区:3区
    OA期刊:混合
  • 综述期刊:
    TOP期刊:
  • 期均国文:7
    环比增速:-12.50%
  • 期刊信息

  • 研究方向:工程技术-PHYSICS, APPLIED物理:应用;ENGINEERING, ELECTRICAL ELECTRONIC工程:电子与电气
  • 国际刊号:ISSN 1530-4388;EISSN 1558-2574
  • 期刊语言:英语
    出版地区:美国
  • 投稿网址:https://ieee.atyponrex.com/journal/tdmr
  • 电子邮箱:
  • 期刊官网:https://eds.ieee.org/publications/transactions-on-device-and-materials-reliability
  • 作者指南:https://eds.ieee.org/publications/transactions-on-device-and-materials-reliability/information-for-authors
  • 出版商网址:http://www.ieee.org
  • 出版地址:IEEE , 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141
  • 期刊简介:IEEE Transactions on Device and Materials Reliability《IEEE器件与材料可靠性汇刊》(季刊). The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems, Transistors, Technology, Integrated Circuits, Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market.

  • 万维提示

  • 1、投稿方式:在线投稿。

    2、期刊网址:

    https://eds.ieee.org/publications/transactions-on-device-and-materials-reliability

    https://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=7298

    3、投稿网址:

    https://ieee.atyponrex.com/journal/tdmr

    4、官网邮箱:isodiana.crupi@unipa.it(主编)

    (更多编辑邮箱见期刊官网信息)

    5、期刊刊期:季刊,一年出版4期。

    2025年11月17星期一



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