IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY《IEEE电磁兼容性汇刊》（双月刊）. IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.

IEEE Transactions on Education《IEEE教育汇刊》（双月刊）. The IEEE Transactions on Education (ToE) publishes significant and original scholarly contributions to education in electrical and electronics engineering, computer engineering, computer science, and other fields within the scope of interest of IEEE. Contributions must address discovery, integration, and/or application of knowledge in education in these fields. Articles must support contributions and assertions with compelling evidence and provide explicit, transparent descriptions of the processes through which the evidence is collected, analyzed, and interpreted. While characteristics of compelling evidence cannot be described to address every conceivable situation, generally assessment of the work being reported must go beyond student self-report and attitudinal data.

IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION《IEEE电介质与电气绝缘汇刊》（双月刊）. The IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) publishes articles on dielectric phenomena and measurements to analyze these phenomena; development and characterization of vacuum, gaseous, liquid, and solid dielectrics and electrical insulating components of systems; investigation of dielectric properties for innovative use including functional dielectrics; diagnostic and prognostic methods with a primary focus on the behavior and properties of the electrical insulation in devices under operational stresses. The description of diagnostic methods without a primary link to the dielectric phenomena studied does not belong in these Transactions.

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY《IEEE器件与材料可靠性汇刊》（季刊）. The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems, Transistors, Technology, Integrated Circuits, Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market.

IEEE TRANSACTIONS ON CONTROL SYSTEMS TECHNOLOGY《IEEE控制系统技术汇刊》（双月刊）. The IEEE Transactions on Control Systems Technology publishes high quality technical papers on technological advances in control engineering. The word technology is from the Greek technologia. The modern meaning is a scientific method to achieve a practical purpose. Control Systems Technology includes all aspects of control engineering needed to implement practical control systems, from analysis and design, through simulation and hardware.

IEEE TRANSACTIONS ON CONSUMER ELECTRONICS《IEEE消费电子学汇刊》（季刊）. The main focus for the IEEE Transactions on Consumer Electronics is the engineering and research aspects of the theory, design, construction, manufacture or end use of mass market electronics, systems, software and services for consumers.

IEEE TRANSACTIONS ON COMPUTERS《IEEE计算机汇刊》（月刊）. The IEEE Transactions on Computers is a monthly publication with a wide distribution to researchers, developers, technical managers, and educators in the computer field. It publishes papers on research in areas of current interest to the readers. These areas include, but are not limited to, the following: a) computer organizations and architectures; b) operating systems, software systems, and communication protocols; c) real-time systems and embedded systems; d) digital devices, computer components, and interconnection networks; e) specification, design, prototyping, and testing methods and tools; f) performance, fault tolerance, reliability, security, and testability; g) case studies and experimental and theoretical evaluations; and h) new and important applications and trends.

IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS《IEEE集成电路与系统的计算机辅助设计汇刊》（月刊）. The purpose of this Transactions is to publish papers of interest to individuals in the area of computer-aided design of integrated circuits and systems composed of analog, digital, mixed-signal, optical, or microwave components. The aids include methods, models, algorithms, and man-machine interfaces for system-level, physical and logical design including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, hardware-software co-design and documentation of integrated circuit and system designs of all complexities. Design tools and techniques for evaluating and designing integrated circuits and systems for metrics such as performance, power, reliability, testability, and security are a focus.

IEEE Transactions on Computational Imaging《IEEE计算成像汇刊》（季刊）. The IEEE Transactions on Computational Imaging publishes articles where computation plays an integral role in the image formation process. Papers will cover all areas of computational imaging ranging from fundamental theoretical methods to the latest innovative computational imaging system designs. Topics of interest will include advanced algorithms and mathematical techniques, model-based data inversion, methods for image and signal recovery from sparse and incomplete data, techniques for non-traditional sensing of image data, methods for dynamic information acquisition and extraction from imaging sensors, software and hardware for efficient computation in imaging systems, and highly novel imaging system design.

Transactions on Components, Packaging and Manufacturing Technology《IEEE器件封装与制造技术汇刊》（月刊）. IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on the modeling, design, physical testing, materials, manufacturing, and reliability of electronic, photonic, RF, MEMS and sensor packaging, electrical contacts and connectors, and their integration in systems and constituent micro-systems. Package design, including heterogeneous integration of different devices in a package and in micro-systems, integration for (electrical, thermal, and thermo-mechanical) performance, manufacturability, reliability, test, and security to ensure performance in different applications are within the scope of the journal.